Failure analysis - trace analysis

Besides the examination of material components, the main focus of malfunction analysis lies on surface analysis. Already the smallest impurities on the surface of components can lead to limited functionality or further processing (coating or rather adhesion problems, or increased conductivities).

This is why a trace analysis plays an important role in this field, we offer the following analyses:

Examination of particulate impurities (particles, fibres):

  • Counting and measurement of metallic and non-metallic particles for example in gearing components
  • Determination of elemental composition of particles via REM-EDX and IR-microscopy
  • Material determination of fibres via IR-microscopy

Testing for organic impurities (stains, films, dry edges, residues):

  • GCMS-examination of filmy impurities
  • Identification of residues via IR-spectroscopy
  • Determination of longer chained and/or polar substances via LCMS/MS

Examination of inorganic impurities (stains, films, dry edges, residues, materials):

  • Determination of elemental composition of residues via REM-EDX
  • Determination of ionic surface load of circuit boards or components via ion chromatography and ICP-OES
  • Determination of halogens (fluoride, chloride, bromide, iodide) on aluminium cast components via ion chromatography
  • Determination of halogens in material samples according to Schöniger-combustion
  • Determination of ions in oils and fats via ion chromatography (elution method)

Contact partner

 

Phone: 09132/75034-0

 

  • Ansprechpartner

    Christian Schad

    Managing director

  • Ansprechpartner

    Dr. Thomas Fürst

    Managing director

  • Ansprechpartner

    Christina Korbacher

    Deputy head of industrial analysis

Contact partner

 

Phone: 09132/75034-0

 

  • Ansprechpartner

    Christian Schad

    Managing director

  • Ansprechpartner

    Dr. Thomas Fürst

    Managing director

  • Ansprechpartner

    Christina Korbacher

    Deputy head of industrial analysis